Inspection Solutions

Pass through defects are anything but uncommon in manufacturing. Regardless of the variables involved, it’s imperative to ensure that all products are correctly manufactured and assembled. By utilizing robust inspection solutions in manufacturing processes, companies are able to ensure the highest level of quality in their products.

Coherix developed the Tru3D™ vision platform to help facilitate the stringent inspection requirements in the manufacturing environment and to solve your toughest inspection problems. The Tru3D solutions are built on a family of robust 3D sensors coupled with our proprietary i-Cite™ software platform. Tru3D utilizes rich 3D data sets to identify and eliminate pass through defects in the manufacturing process.

Compared to 2D vision systems which are vulnerable to environmental influences, changes in part color or contrast, Tru3D is more reliable, simpler to use and more affordable to own. While designing Tru3D, we had five goals; minimize the effects of process noise - such as ambient light and part color/contrast - use 3D information for 3D parts, keep it as simple as possible, use redundant information at all opportunities, and log information for future data mining. With customizable applications, we are able to address a myriad of problems that may arise in your production processes.

By seeing in 3D, we can dramatically improve the robustness of error proofing applications. When you reduce variation, costs go down, quality increases and you shorten the time to bring new products to market. The key? You have to see variation in order to reduce it.

Click here to see how Tru3D can help your organization.

Tru3D - A better place to start.

Tru3D Specs:

  • Smart sensor architecture
  • No moving parts
  • Multiple standoffs
  • Large fields of view
  • IP65 enclosure
  • Fast measurement cycle
  • No relative movement required
  • Rich 3D data sets
  • Redundant validation
  • Variable data saved
  • Multiple PLC options

The Coherix team serves its electronics and semiconductor customers with high-speed in-line inspection products.  The 3DX™ Series is a major advance in the semiconductor inspection technology. Handlers no longer need to stop parts to inspect them.  3DX measures semiconductor packages optically on-the-fly, setting a new standard of throughput. This vision inspection system measures 3D characteristics of up to 70,000 parts per hour! 

All of Coherix’s 2D and 3D systems are based on our proprietary i-Cite™ software. 3DX incorporates a next-generation LED strobe light with multiple cameras. Combined with our i-Cite software, this solution is the fastest, most advanced and easiest-to-use 3D inspection solution in the world today. This technology is a PC-based product, driven by field- proven software.

Download The 3DX Spec Sheet


3DX Specs:

  • 3D high-definition measurements of moving parts - no stopping required
  • Multiple parts measured simultaneously
  • Not dependent on component finishing - no back reflection issue caused by lasers
  • "Snapshot" area measurements - no lasers, no line scanning
  • Easy setup & calibration
  • Meets strictest accuracy demands

i-Cite Specs:

  • No legacy hardware, replace outdated or non-functional components with the latest and greatest
  • Choose exactly the right configuration of cameras and other peripherals for your application
  • Modular Vision Chip™ design allows us to develop your applications in days instead of months
  • Allows OEM’s to quickly respond to the end user’s rapidly changing needs

OPIS™ (Optical Precising Inspection System) is an on-the-fly system for X/Y/A location and 2D inspection of semiconductor components.  OPIS uses a high resolution camera and a sophisticated LED lighting system to generate images of the bottom side of BGA, QFP and QFN. This unique product offers a range of features for the increasing demands in 2D inspection.

OPIS also incorporates electronics to monitor two separate arm encoder inputs and a strobe controller for flashing the lights. The i-Cite™ NxT software harnesses this hardware to collect images, processes images and determines the pass/fail status of the part(s).  

Download The OPIS 1600 Spec Sheet

OPIS Specs:

  • On-the-fly - no stopping required
  • High UPH
  • Multiple parts measured simultaneously
  • Compact, easy setup & calibration
  • Internal encoder controller, strobe & camera sync
  • Several fields of view, resolution, accuracy & speed configurations
  • Recommended PC is the INTEL Core II Duo with 2GB RAM, and Windows XP or higher. 

All of Coherix’s 2D and 3D inspection systems are based on our proprietary i-Cite™ software. This includes Tru3D, 3DX and OPIS.   i-Cite executes on any standard PC running the Windows 2000 Pro, XP Pro or 7 operating systems, and supports a dozen different frame grabbers, as well as many USB, and Firewire, Ethernet cameras.

By using i-Cite, you are free of all legacy hardware, you can precisely choose the right configuration of cameras and other peripherals for your application. Our modular Vision Chip™ design allows us to develop your applications in days instead of months which in turn allow OEM’s to quickly respond to the end user’s rapidly changing needs. On top of these benefits, our clients typically save 30% in hardware costs.

i-Cite’s integrated features include:

  • Overlapped image acquisition and processing
  • Multiple, asynchronous, simultaneous inspections
  • Multiple, simultaneous frame grabber support
  • Support for up to 16 analog, digital, Camera Link, USB, IEEE 1394, and Gigabit Ethernet cameras per application
  • 8-bit, 10-bit and 12-bit image depth support
  • Strobe control for on-the-fly image acquisition
  • Multiple, asynchronous, concurrent machine interfaces (Socket, Pipe, RS-232, DIO)
  • Variable rate digital video recorder
  • Failed part image collection and analysis tools (FailurePackets™) with built-in Internet support
  • Drill down graphical diagnostic capability for all image processing operations
  • Protocol and logic analyzer
  • Remote embedded display capability
  • Pan/tilt control for automated feature/target tracking
  • Four customizable access levels (password protected)
  • Online help (F1 help and chip level help)
  • Fully customizable data collection reports
  • Fully customizable GUIs with drag and drop GUI builder
  • Fully customizable runtime displays

i-Cite’s image processing features include:

  • Rotation independent pattern location (high frequency, low frequency and model based)
  • Defect detection (completeness, correct assembly and/or surface)
  • 2D, 3D part gauging
  • Color processing
  • Thermal processing
  • Grayscale processing (kernel based)
  • Semiconductor inspection (BGA, QFP, TSOP, etc.)
  • 2D bar code reading (2D matrix)
  • Grayscale template matching
  • Connected component analysis

Typical accuracy:

  • Edge detection: +/- 0.25 pixels (3 sigma)
  • Feature location: +/- 0.20 pixels (3 sigma)

Typical processing times (3 GHz P4):

  • Sub pixel edge location: 0.2 ms
  • Sub pixel feature location (full screen search, 1296 x 1016): 12 ms
  • Sub pixel feature location (window search, 100 x 100): 0.25 ms

Vision Chip™ 

i-Cite's Vision Chip functional modules are why we can respond to you so quickly and completely. There are more than 120 of these highly optimized software modules containing algorithms, functions, controls and parameters that allow us to:

  • Configure Vision Chip parameters to fit your application, including creating custom panels, displays and collection reports
  • Drag and drop Vision Chips into the virtual circuit diagram
  • Support all applications with single version software

Each configurable Vision Chip module performs several high-level functions, such as waiting for a part-in-place signal, finding the location of an object, or inspecting defects.

Each Vision Chip has a configuration panel with built in graphical and statistical displays that allow you to see exactly what is happening at every step of the imaging processing operation...down to the pixel level, if desired.

Image Processing Vision Chips provide the algorithms and parameters for processing the machine vision application. Sub-pixel algorithms maximize the accuracy of measurements.

Communication Vision Chips provide communication between the i-Cite application and the mechanical system on which it is running.

System Vision Chips provide the infrastructure for controlling the flow of the circuit(s) in the project.